SEOUL, Nov 12 (Reuters) – South Korean President Lee Jae Myung said on Thursday that Samsung Electronics’ 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.
($1 = 1,339.5500 won)
(Reporting by Joyce LeeEditing by Ed Davies)
